Investigation of deplating behavior of Pt contact pins in...

Thin Solid Films 2008 Vol. 517; Iss. 3

Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process

Shao-Yu Hu, Chi-Cheng Hung, Wen-Hsi Lee, Shih-Chieh Chang, Din-Yuen Chan, Ying-Lang Wang
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Volume:
517
Year:
2008
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2008.05.024
File:
PDF, 481 KB
english, 2008
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