Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling
Hwang, Soo Jung, Park, Hyun, Lee, Je Hun, Oh, Kyu Hwan, Joo, Young ChangVolume:
408-412
Year:
2002
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.408-412.1651
File:
PDF, 520 KB
2002