Time-to-failure analysis of 5 nm amorphous Ru(P) as a...

Time-to-failure analysis of 5 nm amorphous Ru(P) as a copper diffusion barrier

Lucas B. Henderson, John G. Ekerdt
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
517
Year:
2009
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2008.10.009
File:
PDF, 385 KB
english, 2009
Conversion to is in progress
Conversion to is failed