Polyimide modified with metal coupling agent for adhesion...

Thin Solid Films 2009 Vol. 517; Iss. 17

Polyimide modified with metal coupling agent for adhesion application

Mei-Hui Tsai, Yin-Kai Lin, Chi-Jung Chang, Pei-Chun Chiang, Jui-Ming Yeh, Wei-Ming Chiu, Shih-Liang Huang, Sheng-Chung Ni
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Volume:
517
Year:
2009
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2009.03.155
File:
PDF, 543 KB
english, 2009
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