Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free...

Key Engineering Materials 2007 Vol. 353-358

Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free Soldered Joints for Surface Mount Technology

Zhang, Ke Ke, Wang, Yao Li, Fan, Yan Li, Yiang, Jie, Yan, Yan Fu, Zhang, Xin
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Volume:
353-358
Year:
2007
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.353-358.2912
File:
PDF, 348 KB
english, 2007
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