A non-contact, thermally-driven buckling delamination test...

Thin Solid Films 2010 Vol. 518; Iss. 8

A non-contact, thermally-driven buckling delamination test to measure interfacial fracture toughness of thin film systems

S. Goyal, K. Srinivasan, G. Subbarayan, T. Siegmund
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Volume:
518
Year:
2010
Language:
english
Pages:
9
DOI:
10.1016/j.tsf.2009.07.148
File:
PDF, 1011 KB
english, 2010
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