Pad flattening ratio, coefficient of friction and removal...

Thin Solid Films 2010 Vol. 518; Iss. 8

Pad flattening ratio, coefficient of friction and removal rate analysis during silicon dioxide chemical mechanical planarization

H. Lee, Y. Zhuang, M. Sugiyama, Y. Seike, M. Takaoka, K. Miyachi, T. Nishiguchi, H. Kojima, A. Philipossian
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Volume:
518
Year:
2010
Language:
english
Pages:
7
DOI:
10.1016/j.tsf.2009.07.193
File:
PDF, 868 KB
english, 2010
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