A three-step copper chemical mechanical planarization model...

Thin Solid Films 2010 Vol. 518; Iss. 14

A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry

D. DeNardis, D. Rosales-Yeomans, L. Borucki, A. Philipossian
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Volume:
518
Year:
2010
Language:
english
Pages:
7
DOI:
10.1016/j.tsf.2009.12.088
File:
PDF, 608 KB
english, 2010
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