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Microstructure, Conductivity and Hardness of Cu and Ag-Based Compacts with Immiscible Elements
Tousimi, K., Yavari, Alain Reza, Ahn, Jung Ho, Sulpice, AndreVolume:
307
Year:
1999
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.307.223
File:
PDF, 579 KB
1999