Development and characterization of Au–Cu seal ring for...

Development and characterization of Au–Cu seal ring for lead free packaging of MEMS devices

R.P. Sharma, P.K. Khanna, D. Kumar
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Volume:
519
Year:
2010
Language:
english
Pages:
4
DOI:
10.1016/j.tsf.2010.08.026
File:
PDF, 811 KB
english, 2010
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