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An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-Free Solders Using Surface Deformation
Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, OsamuVolume:
326-328
Year:
2006
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.326-328.1035
File:
PDF, 602 KB
english, 2006