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Sn-Ag Solder Bump Formation for Flip-Chip Bonding by Electroplating
Arai, Susumu, Akatsuka, Hideki, Kaneko, NorioVolume:
150
Year:
2003
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1606687
File:
PDF, 807 KB
english, 2003