Reliability Estimation of Solder Joint Utilizing Thermal...

Key Engineering Materials 2005 Vol. 297-300

Reliability Estimation of Solder Joint Utilizing Thermal Fatigue Models

Lee, Ouk Sub, Myoung, No Hoon, Kim, Dong Hyeok
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Volume:
297-300
Year:
2005
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.297-300.1816
File:
PDF, 299 KB
english, 2005
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