Ultrasonic Evaluation of Creep Damage of High Temperature...

Key Engineering Materials 2004 Vol. 270-273

Ultrasonic Evaluation of Creep Damage of High Temperature Metallic Materials with Different Microstructures

Byeon, Jai Won, Song, J.H., Kwun, S.I.
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Volume:
270-273
Year:
2004
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.270-273.120
File:
PDF, 1.34 MB
english, 2004
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