Effect of Strain Rate on Microstructural Evolution of...

Materials Science Forum 2008 Vol. 580-582

Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Lee, Seong Hee, Kim, Sang Shik, Han, Seung Zeon, Lim, Cha Yong
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Volume:
580-582
Year:
2008
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.580-582.71
File:
PDF, 3.90 MB
english, 2008
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