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[Emerging Technology in Advanced Packaging Series] Foldable Flex and Thinned Silicon Multichip Packaging Technology Volume 1 || Flexible, Microarray Interconnection Technique Applied to Biomedical Microdevices
Balde, John W.Volume:
10.1007/97
Year:
2003
Language:
english
DOI:
10.1007/978-1-4615-0231-9_6
File:
PDF, 2.97 MB
english, 2003