Microstructural Investigation of Grain Boundary Diffusion...

Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites

Lee, J.S., Kim, T.H., Lee, K.H.
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Volume:
126-128
Year:
1993
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.126-128.399
File:
PDF, 472 KB
1993
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