Aluminum-coated silicon wafer bonding with tin intermediate layer
Zhu, Zhiyuan, Yu, Min, Tian, Dayu, Zhu, Yingwei, Wang, Peiquan, Liu, Chenchen, Wang, Wei, Miao, Min, Chen, Jing, Jin, YufengVolume:
12
Language:
english
Journal:
Journal of Micro/Nanolithography, MEMS, and MOEMS
DOI:
10.1117/1.JMM.12.1.013012
Date:
February, 2013
File:
PDF, 2.45 MB
english, 2013