A comparison of various dielectric/metal sidewall diffusion barriers for Cu/porous ultra-low-K interconnect technology in terms of leakage current and breakdown voltage
Wai-Shing Lau, Hwa-Jin Tan, Zhe Chen, Chao-Yong LiVolume:
81
Year:
2007
Language:
english
Pages:
7
DOI:
10.1016/j.vacuum.2007.01.065
File:
PDF, 581 KB
english, 2007