Corrigendum to “Reactive-ion-etching (RIE) process in CF4 plasma as a method of fluorine implantation” [Vacuum 82 (2008) 1046-1050]
Malgorzata Kalisz, R.B. Beck, M. ĆwilVolume:
83
Year:
2008
DOI:
10.1016/j.vacuum.2008.06.001
File:
PDF, 65 KB
2008