Detection and characterization of three-dimensional interconnect bonding voids by infrared microscopy
Höglund, Jonny, Kiss, Zoltan, Nadudvari, Gyorgy, Kovacs, Zsolt, Velkei, Szabolcs, Moore, Chris, Vartanian, Victor, Allen, Richard A.Volume:
13
Language:
english
Journal:
Journal of Micro/Nanolithography, MEMS, and MOEMS
DOI:
10.1117/1.jmm.13.1.011208
Date:
February, 2014
File:
PDF, 3.32 MB
english, 2014