Recrystallization Texture of a Copper Electrodeposit with the and Duplex Orientation
Kang, Soo Young, Lee, Dong NyungVolume:
408-412
Year:
2002
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.408-412.895
File:
PDF, 422 KB
2002