Thermophysical Behavior of Micro Void in μ-Via of...

Advanced Materials Research 2007 Vol. 26-28

Thermophysical Behavior of Micro Void in μ-Via of Microelectronic Substrate during Reliability Test

Lee, Hyo Soo, Lee, Hai Joong, Lim, Sung Chul, Kwon, Hyuk Chon
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Volume:
26-28
Year:
2007
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.26-28.1261
File:
PDF, 346 KB
english, 2007
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