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Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate
Liu, Yang, Sun, Fenglian, Luo, Liangliang, Yuan, Cadmus A., Zhang, GuoqiVolume:
44
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-015-3774-9
Date:
July, 2015
File:
PDF, 3.09 MB
english, 2015