Thermal Performances Analysis of Microelectronic Chip...

Advanced Materials Research 2011 / 3 Vol. 216

Thermal Performances Analysis of Microelectronic Chip Cooling System with Thermoelectric Components

Wang, Chang Hong, Zhang, Jiang Yun, Huang, Jin
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Volume:
216
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.216.128
Date:
March, 2011
File:
PDF, 323 KB
english, 2011
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