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Difference in Annealing Characteristics of Nanostructured Copper Alloys Processed by Accumulative Roll Bonding
Lee, Seong Hee, Han, Seung Zeon, Lim, Cha YongVolume:
124-126
Year:
2007
Language:
english
Journal:
Solid State Phenomena
DOI:
10.4028/www.scientific.net/SSP.124-126.1373
File:
PDF, 3.23 MB
english, 2007