Wire bonding quality monitoring via refining process of...

Mechanical Systems and Signal Processing 2011 Vol. 25; Iss. 3

Wire bonding quality monitoring via refining process of electrical signal from ultrasonic generator

Wuwei Feng, Qingfeng Meng, Youbo Xie, Hong Fan
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Volume:
25
Year:
2011
Language:
english
Pages:
17
DOI:
10.1016/j.ymssp.2010.09.010
File:
PDF, 857 KB
english, 2011
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