Physical Properties of Plywood and Waferboard as Pile...

Physical Properties of Plywood and Waferboard as Pile Cushion Materials

Womack, Kevin C., Whitaker , Aaron M., Caliendo, Joseph A., Goble, George G., Halling, Marvin W.
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Volume:
129
Language:
english
Journal:
Journal of Geotechnical and Geoenvironmental Engineering
DOI:
10.1061/(asce)1090-0241(2003)129:4(379)
Date:
April, 2003
File:
PDF, 49 KB
english, 2003
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