[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Challenges in the reliability of 3D integration using TSVs
Stiebing, M., Vogel, D., Steller, W., Wolf, M.J., Wunderle, B.Year:
2015
Language:
english
DOI:
10.1109/EuroSimE.2015.7103129
File:
PDF, 1.24 MB
english, 2015