SPIE Proceedings [SPIE The International Conference on Micro- and Nano-Electronics 2014 - Zvenigorod, Russian Federation (Monday 6 October 2014)] International Conference on Micro- and Nano-Electronics 2014 - Approaches to a dies decoupling during failure analysis of the 3D package integrated circuits
Orlikovsky, Alexander A., Molodtsova, G., Milovanov, R., Zubov, D., Kelm, E.Volume:
9440
Year:
2014
Language:
english
DOI:
10.1117/12.2181199
File:
PDF, 696 KB
english, 2014