A Material Removal Modeling of Chemical Mechanical Polishing Based on Micro-Contact Mechanism
Du, Shi Wen, Li, Yong Tang, Song, Jian Jun, Qi, Hui PingVolume:
474-476
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.474-476.472
Date:
April, 2011
File:
PDF, 287 KB
english, 2011