Fabrication of Cu-SiCp Composites via the Electroless...

Advanced Materials Research 2013 / 9 Vol. 795

Fabrication of Cu-SiCp Composites via the Electroless Copper Coating Process for the Electronic Packaging Applications

Azmi, K., Mustafa Al Bakri, Abdullah Mohd, Mohd Salleh, M.A.A.
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Volume:
795
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.795.272
Date:
September, 2013
File:
PDF, 1.18 MB
english, 2013
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