SPIE Proceedings [SPIE Second International Conference on Experimental Mechanics - Singapore, Singapore (Wednesday 29 November 2000)] Second International Conference on Experimental Mechanics - Use of optical technique for inspection of warpage of IC packages
Toh, Siew-Lok, Chau, Fook S., Ong, Sim Heng, Chau, Fook S., Quan, ChenggenVolume:
4317
Year:
2001
Language:
english
DOI:
10.1117/12.429546
File:
PDF, 440 KB
english, 2001