Effects of Process Parameters on the Adhesion of Copper...

Effects of Process Parameters on the Adhesion of Copper Film on Polyethylene Tetrephthalate(Pet) Substrate Prepared by ECRMOCVD Coupled with a Periodic DC Bias

Hyun, Jin, Jeon, Bup Ju, Byun, Dongjin, Lee, Joong Kee
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Volume:
795
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-795-U8.5
Date:
January, 2003
File:
PDF, 2.00 MB
english, 2003
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