![](/img/cover-not-exists.png)
Characterization of Wafer Surface Topography after CMP
Wang, Ru, Wang, Juan, Sun, Ming, Gao, Bao Hong, Yang, Rui Xia, Liu, Yu LingVolume:
476-478
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.476-478.2603
Date:
February, 2012
File:
PDF, 262 KB
english, 2012