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Dependence of wet etch rate on deposition, annealing conditions and etchants for PECVD silicon nitride film
Longjuan, Tang, Yinfang, Zhu, Jinling, Yang, Yan, Li, Wei, Zhou, Jing, Xie, Yunfei, Liu, Fuhua, YangVolume:
30
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/30/9/096005
Date:
September, 2009
File:
PDF, 321 KB
english, 2009