[IEEE 2014 International Conference on Optical MEMS and Nanophotonics (OMN) - Glasgow, UK (2014.8.17-2014.8.21)] 2014 International Conference on Optical MEMS and Nanophotonics - High-precision integration approach based on alignment maintaining flip-chip bonding using cone shaped bump and truncated pyramid pad
Tung, Bui Thanh, Ma, Laina, Amano, Takeru, Kikuchi, Katsuya, Aoyagi, MasahiroYear:
2014
Language:
english
DOI:
10.1109/OMN.2014.6924558
File:
PDF, 329 KB
english, 2014