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Influence of AlN Intergranular Phases on Wetting and Bonding between Copper and Aluminum Nitride
Joyeux, Thierry, Jarrige, Jean, Labbe, J.C., Lecompte, J.P.Volume:
206-213
Year:
2002
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.206-213.555
File:
PDF, 345 KB
2002