Suppression of Stress-Induced Voiding by Controlling...

Japanese Journal of Applied Physics 2013 / 05 Vol. 52; Iss. 5S3

Suppression of Stress-Induced Voiding by Controlling Microstructure of Cu Electroplated Films

Muranaka, Seiji, Omori, Kazuyuki, Mori, Kenichi, Maekawa, Kazuyoshi, Shibata, Ryuji, Suzumura, Naohito, Kudo, Shuichi, Fujisawa, Masahiko
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Volume:
52
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.52.05FB02
Date:
May, 2013
File:
PDF, 3.98 MB
english, 2013
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