A novel interconnect optimal buffer insertion model...

Journal of Semiconductors 2013 / 11 Vol. 34; Iss. 11

A novel interconnect optimal buffer insertion model considering the self-heating effect

Zhang, Yan, Dong, Gang, Yang, Yintang, Wang, Ning, Ding, Yaoshun, Liu, Xiaoxian, Wang, Fengjuan
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Volume:
34
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/34/11/115004
Date:
November, 2013
File:
PDF, 597 KB
english, 2013
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