Highly Conductive and Reliable Copper-Filled Isotropically...

Journal of Electronic Materials 2015 / 7 Vol. 44; Iss. 7

Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention

Chen, Wenjun, Deng, Dunying, Cheng, Yuanrong, Xiao, Fei
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Volume:
44
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-015-3798-1
Date:
July, 2015
File:
PDF, 1.94 MB
english, 2015
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