A wafer-level multi-chip module process with thick...

A wafer-level multi-chip module process with thick photosensitive benzocyclobutene as the dielectric for microwave application

Tang, Jiajie, Sun, Xiaowei, Luo, Le
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Volume:
21
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/21/6/065035
Date:
June, 2011
File:
PDF, 7.48 MB
english, 2011
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