A wafer-level multi-chip module process with thick photosensitive benzocyclobutene as the dielectric for microwave application
Tang, Jiajie, Sun, Xiaowei, Luo, LeVolume:
21
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/21/6/065035
Date:
June, 2011
File:
PDF, 7.48 MB
english, 2011