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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Performance and reliability study of TGV interposer in 3D integration
Wei, Tiwei, Wang, Qian, Cai, Jian, Chen, Le, Huang, Jones, Wang, Lu, Zhang, Long, Li, ChengYear:
2014
Language:
english
DOI:
10.1109/EPTC.2014.7028398
File:
PDF, 3.22 MB
english, 2014