Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu...

Materials Science Forum 2005 Vol. 502

Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint

Wang, Feng Jiang, Ma, Xin, Qian, Yiyu
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Volume:
502
Year:
2005
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.502.399
File:
PDF, 530 KB
english, 2005
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