Formation of Co-implanted Silicon Ultra-Shallow Junctions...

Chinese Physics Letters 2013 / 01 Vol. 30; Iss. 1

Formation of Co-implanted Silicon Ultra-Shallow Junctions for Low Thermal Budget Applications

Mustafa, Rehana, Ahmed, S., Khan, E. U.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
30
Language:
english
Journal:
Chinese Physics Letters
DOI:
10.1088/0256-307X/30/1/016101
Date:
January, 2013
File:
PDF, 346 KB
english, 2013
Conversion to is in progress
Conversion to is failed