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Effects of Different Die and Epoxy Thickness to the QFN Package
Abdullah, Huda, Shaarani, Muhd Fauzi Aminuddin ShaziVolume:
462-463
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.462-463.943
Date:
January, 2011
File:
PDF, 383 KB
english, 2011