A Wafer-Level Sn-Rich Au—Sn Bonding Technique and Its...

Chinese Physics Letters 2014 / 05 Vol. 31; Iss. 5

A Wafer-Level Sn-Rich Au—Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors

Mao, Xu, Lv, Xing-Dong, Wei, Wei-Wei, Zhang, Zhe, Yang, Jin-Ling, Qi, Zhi-Mei, Yang, Fu-Hua
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Volume:
31
Language:
english
Journal:
Chinese Physics Letters
DOI:
10.1088/0256-307X/31/5/056803
Date:
May, 2014
File:
PDF, 76 KB
english, 2014
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