![](/img/cover-not-exists.png)
SPIE Proceedings [SPIE International Symposium on Microelectronics and MEMS - Adelaide, Australia (Monday 17 December 2001)] Device and Process Technologies for MEMS and Microelectronics II - MEMS sensor packaging using LTCC substrate technology
Kopola, Harri K., Lenkkeri, Jaakko, Kautio, Kari, Torkkeli, Altti, Rusanen, Outi, Jaakola, Tuomo, Chiao, Jung-Chih, Faraone, Lorenzo, Harrison, H. Barry, Shkel, Andrei M.Volume:
4592
Year:
2001
Language:
english
DOI:
10.1117/12.448960
File:
PDF, 1001 KB
english, 2001