Effects of Material Properties and Thickness of Die Attach...

Effects of Material Properties and Thickness of Die Attach on Package Delamination of IC Packages

Chang, Chia Lung, Chang, Cheng Lun, Wang, Ying Long
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Volume:
479-481
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.479-481.2564
Date:
February, 2012
File:
PDF, 376 KB
english, 2012
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