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Effects of Material Properties and Thickness of Die Attach on Package Delamination of IC Packages
Chang, Chia Lung, Chang, Cheng Lun, Wang, Ying LongVolume:
479-481
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.479-481.2564
Date:
February, 2012
File:
PDF, 376 KB
english, 2012