Reliability study of thermal cycling stress on smart power...

Japanese Journal of Applied Physics 2014 / 01 Vol. 53; Iss. 4S

Reliability study of thermal cycling stress on smart power devices

Zhang, Ming, Yoshihisa, Yasuki, Furuya, Keiichi, Imai, Yukari, Hatasako, Kenichi, Ipposhi, Takashi, Maegawa, Shigeto
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
53
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.53.04EP12
Date:
January, 2014
File:
PDF, 1.29 MB
english, 2014
Conversion to is in progress
Conversion to is failed